$30 billion semiconductor plants don’t just spring up over night. Back in November 2021, we told you that Dallas-based Texas Instruments had chosen Sherman as the site for a campus of up to four new 300-millimeter semiconductor wafer fabrication plants, or fabs. With a $30 billion investment and up to 4.7 million square feet at full build-out, the campus would be the largest electronics production facility in Texas.
Texas Instruments broke ground on the new fabs in May 2022, noting that the project could ultimately support as many as 3,000 direct jobs. The new fabs will manufacture tens of millions of analog and embedded processing chips daily that will go into electronics everywhere, the company said at the time.
May 2022 groundbreaking: Texas Instruments Chairman, President and CEO Rich Templeton (center); Texas Governor Greg Abbott; and Sherman Mayor David Plyler, along with company leaders, participate in a groundbreaking ceremony for TI’s new 300-mm semiconductor wafer fabs in Sherman, Texas. [Photo: TI]
With construction underway, Dallas Business Journal reports that the project’s initial phase will have an estimated cost of over $2.2 billion covering more than 4.2 million square feet, according to construction documents filed last week with the state.
The initial work scope includes a large building with two semiconductor clean rooms, utilities, warehousing, material loading docks, garage parking, and an administration building and support buildings connected to the main fab, the DBJ added, noting that the construction started in September and is scheduled for completion by August 2024.
Production from the first Sherman fab is expected in 2025, TI has said. The fabs will complement the company’s existing 300-mm fabs, which include DMOS6 in Dallas and RFAB1 and RFAB2 in Richardson. In addition,, TI plans to build its next 300-millimeter fab in Lehi, Utah, next to the company’s existing 300-mm semiconductor wafer fab in the city—another big investment of $11 billion.
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The new 300-mm wafer fabrication plant will help support the future growth of semiconductors in electronics. Called RFAB2, the new "fab" is connected to RFAB1, which opened in 2009 as the world’s first 300-mm analog wafer fab. Inside, 15 miles of automated, overhead delivery systems will eventually move wafers between the two fabs. At full production, the Richardson fabs will manufacture more than 100 million analog chips a day that will go into electronics everywhere, TI says.
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