Monolithic 3D Inc. in Allen, has received a newly granted for a method of producing multilayer 3D semiconductor devices. The technology details a process for stacking multiple layers of single-crystal silicon with precise bonding and epitaxial growth techniques to create high-performance, space-efficient chips. The patent was invented by Jin-Woo Han of San Jose and Zvi Or-Bach of Haifa. [Composite illustration: Sources, USPTO Patent #12432926; DI Studio]