New power modules with MagPack™ technology are up to 50% smaller than previous generations, doubling power density while maintaining excellent thermal performance. [Photo: Texas Instruments]
Dallas-based semiconductor giant Texas Instruments Inc. plans to build its next 300-millimeter semiconductor wafer fabrication plant, or fab, in Lehi, Utah, next to the company’s existing 300-mm semiconductor wafer fab in Lehi.
Once completed, TI’s two Lehi fabs will operate as a single fab.
“This new fab is part of our long-term, 300-mm manufacturing roadmap to build the capacity our customers will need for decades to come,” Haviv Ilan, TI executive vice president and chief operating officer, and incoming president and chief executive officer, said in a statement....
Comerica’s top executive has been elected to join the board of Dallas-based semiconductor giant Texas Instruments Inc., effective April 1.
Curtis C. Farmer is chairman, president and chief executive officer of Dallas-based Comerica Inc....
Texas Instruments, the Dallas-based semiconductor giant, announced that Haviv Ilan will become the company’s new president and chief executive officer, effective April 1.
Current president and CEO Rich Templeton will remain with TI as its chairman, the company said....