Dallas-based semiconductor giant Texas Instruments Inc. plans to build its next 300-millimeter semiconductor wafer fabrication plant, or fab, in Lehi, Utah, next to the company’s existing 300-mm semiconductor wafer fab in Lehi.
Once completed, TI’s two Lehi fabs will operate as a single fab.
Haviv Ilan of Texas Instruments [Photo: courtesy of TI]
“This new fab is part of our long-term, 300-mm manufacturing roadmap to build the capacity our customers will need for decades to come,” Haviv Ilan, TI executive vice president and chief operating officer, and incoming president and chief executive officer, said in a statement. “Our decision to build a second fab in Lehi underscores our commitment to Utah and is a testament to the talented team there who will lay the groundwork for another important chapter in TI’s future. With the anticipated growth of semiconductors in electronics, particularly in industrial and automotive, and the passage of the CHIPS and Science Act, there is no better time to further invest in our internal manufacturing capacity.”
TI said the $11 billion investment marks the largest economic investment in Utah history.
The expansion in Lehi will create roughly 800 more TI jobs as well as thousands of indirect jobs. The company said that it looks forward to strengthening its partnership with the Alpine School District and will invest $9 million to improve student opportunities and outcomes.
“Companies like Texas Instruments continue to invest in Utah because of our world-class business climate and exceptional workforce,” Utah Gov. Spencer Cox said in a statement. “TI’s new semiconductor fab will solidify Utah as a global semiconductor manufacturing hub for generations to come.”
The new fab will manufacture tens of millions of analog and embedded processing chips daily that will go into electronics everywhere, TI said.
The fab will be designed to meet one of the Leadership in Energy and Environmental Design (LEED) building rating system’s highest levels of structural efficiency and sustainability: LEED Gold, the company said.
Plans for the fab include recycling water at nearly double the rate of the existing Lehi fab.
Construction of the new fab is expected to begin in the second half of 2023, with production as early as 2026, TI said.
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R E A D N E X T
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The new 300-mm wafer fabrication plant will help support the future growth of semiconductors in electronics. Called RFAB2, the new "fab" is connected to RFAB1, which opened in 2009 as the world’s first 300-mm analog wafer fab. Inside, 15 miles of automated, overhead delivery systems will eventually move wafers between the two fabs. At full production, the Richardson fabs will manufacture more than 100 million analog chips a day that will go into electronics everywhere, TI says.
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