Aerial photo of Texas Instruments Lehi Fab

Texas Instruments to Build Second Semiconductor Wafer Plant in Lehi, Utah

by | Feb 17, 2023

Dallas-based semiconductor giant Texas Instruments Inc. plans to build its next 300-millimeter semiconductor wafer fabrication plant, or fab, in Lehi, Utah, next to the company’s existing 300-mm semiconductor wafer fab in Lehi.

Once completed, TI’s two Lehi fabs will operate as a single fab.

“This new fab is part of our long-term, 300-mm manufacturing roadmap to build the capacity our customers will need for decades to come,” Haviv Ilan, TI executive vice president and chief operating officer, and incoming president and chief executive officer, said in a statement....

Texas Instruments’ Newest Fab Plant in Richardson Kicks Off Wafer Production
by | Oct 3, 2022
The new 300-mm wafer fabrication plant will help support the future growth of semiconductors in electronics. Called RFAB2, the new "fab" is connected to RFAB1, which opened in 2009 as the world’s first 300-mm analog wafer fab. Inside, 15 miles of automated, overhead delivery systems will eventually move wafers between the two fabs. At full production, the Richardson fabs will manufacture more than 100 million analog chips a day that will go into electronics everywhere, TI says.