Dallas-based semiconductor giant Texas Instruments Inc. plans to build its next 300-millimeter semiconductor wafer fabrication plant, or fab, in Lehi, Utah, next to the company’s existing 300-mm semiconductor wafer fab in Lehi.
Once completed, TI’s two Lehi fabs will operate as a single fab.
“This new fab is part of our long-term, 300-mm manufacturing roadmap to build the capacity our customers will need for decades to come,” Haviv Ilan, TI executive vice president and chief operating officer, and incoming president and chief executive officer, said in a statement....
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