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Jeff Morroni
New power modules with MagPack™ technology are up to 50% smaller than previous generations, doubling power density while maintaining excellent thermal performance. [Photo: Texas Instruments]
Texas Instruments Launches New Magnetic Packaging Tech for Power Modules, Doubling Power Density
by Lance Murray | Jul 16, 2024
Dallas-based TI says the innovation uses proprietary, newly engineered material and has been "nearly a decade in the making." Jeff Morroni of TI's Kilby Labs added that designers "turn to power modules to save on time, complexity, size and component count, but these benefits have required a compromise on performance—until now."
