Texas Instruments President and CEO Haviv Ilan (center), Texas Governor Greg Abbott, Sherman Mayor Shawn Teamann, and company leaders celebrate the official ribbon-cutting ceremony at TI's new 300mm semiconductor fab in Sherman. [Photo: TI]
An employee monitors a wafer transfer at one of Texas Instruments’ 300mm semiconductor fabs in Sherman, Texas, SM1. [Photo: Texas Instruments]
TI's MSPM0C1104 in a wafer chip-scale package measures only 1.38 millimeters. [Photo: Texas Instruments]
TI employee examines a finished GaN chip. GaN chips enable energy-efficient, reliable and power-dense end products. [Photo: Texas Instruments]